Home Technology peripherals It Industry Samsung Electronics reiterates that the SF1.4 process is expected to be mass-produced in 2027 and plans to enter the field of co-packaging optics

Samsung Electronics reiterates that the SF1.4 process is expected to be mass-produced in 2027 and plans to enter the field of co-packaging optics

Jun 13, 2024 pm 05:10 PM
Samsung Electronics Advanced process Co-packaged optics

According to news from this site on June 13, Samsung Electronics reiterated at the Samsung Foundry Forum 2024 North America held on June 12, local time, that its SF1.4 process is expected to be mass-produced in 2027, countering previous media rumors. .

Samsung said its 1.4nm-level process preparations are progressing smoothly, and is expected to reach mass production milestones in terms of performance and yield in 2027.

In addition, Samsung Electronics is actively researching advanced logic process technology in the post-1.4nm era through innovations in materials and structures to realize Samsung's commitment to continuously surpass Moore's Law.

Samsung Electronics simultaneously confirmed that it still plans to mass produce the second-generation 3nm process SF3 in the second half of 2024.

In the more traditional FinFET transistor part, Samsung Electronics plans to launch the SF4U process in 2025. This node will further enhance competitiveness in terms of PPA metrics through optical shrinkage.

三星电子重申 SF1.4 工艺有望于 2027 年量产,计划进军共封装光学领域

Cui Shirong, head of the Foundry Business Department of Samsung Electronics, also said:

We still plan to launch products for high-speed, low-speed Integrated co-packaged optics (CPO) technology for power data processing provides customers with the one-stop artificial intelligence solutions they need to thrive in this transformative era.

This site has reported earlier that in addition to Intel, which has accumulated deep experience in the field of optoelectronics, TSMC, another member of the three advanced process giants, also plans to launch a joint venture based on COUPE technology integration in 2026. Packaged optical module.

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