Ming-Chi Kuo: Apple iPhone 17 will not use new space-saving motherboard materials

IT House News on July 17, according to the latest news from Apple analyst Ming-Chi Kuo, Apple has once again postponed its plan to use new resin-coated copper foil (RCC) components in the iPhone. The internal space-saving component was originally planned for the iPhone 16, then delayed to the iPhone 17, and now again.

1. IT House noticed that Ming-Chi Kuo pointed out in October last year that RCC can reduce the thickness of the motherboard, save internal space, and because it does not contain fiberglass, the drilling process is easier.

2. However, Apple and its suppliers have been facing challenges in using RCC, mainly due to durability and fragility issues, which is what led to this delay.

   

   1. Ming-Chi Kuo said in a brief update posted on The material is used in the iPhone's motherboard, and users may not directly notice the change. But the change will free up more space inside the iPhone, allowing Apple to create a thinner body or explore other ways to use the added space.
3. It’s unclear whether Apple will adopt RCC on the 2026 iPhone 18 or delay the plan further.

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